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Nanjing to host 24th semiconductor packaging conference, with Huawei confirmed
The 24th Semiconductor Packaging and Testing Technology and Market Annual Conference is scheduled for November 4–6, 2026, at Nanjing Fengda International Hotel, with 2,000 participants planned. Huawei, Loongson and Xiaomi Auto are confirmed to attend. The program includes a main forum, thematic presentations and supply-demand matchmaking focused on developments in advanced packaging.
What to know
- 01
The China Semiconductor Industry Association provides guidance, while its packaging and testing branch organizes the conference.
- 02
ZTE, Alibaba, Nanjing University and Tsinghua University also appear on the participant list.
Why it matters
The event is relevant to advanced packaging because it brings together companies from packaging and testing, chip design, glass substrates and TGV.
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