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Samsung to adopt TSMC’s 3nm process for NVIDIA custom HBM base dies
Samsung Electronics will use TSMC’s 3nm process for base dies in NVIDIA’s custom NVHBM, according to the Seoul Economic Daily. NVIDIA also requires suppliers to use the 1c DRAM process for core dies, seeking consistent performance and less supplier-specific validation. Samsung plans to retain its one-stop manufacturing approach for standard HBM and custom products for other customers.
What to know
- 01
NVIDIA’s requirements cover Samsung Electronics, SK hynix and Micron: TSMC’s 3nm process for base dies and sixth-generation 1c DRAM for core dies.
- 02
Samsung plans to retain in-house production for custom HBM supplied to customers such as AMD, while testing whether its own lines can manufacture NVHBM base dies.
Why it matters
The reported change highlights NVIDIA’s requirements for standardized custom HBM production, while Samsung retains its one-stop manufacturing approach for other HBM products.
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