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Canon reportedly plans 50% boost to back-end lithography equipment capacity by 2029
Canon plans to raise production capacity for semiconductor back-end lithography equipment by 50% from current levels by 2029, according to Nikkan Kogyo Shimbun. It is developing i-line equipment for advanced packaging and has developed a large-substrate machine with 0.8-micrometer resolution, supporting 510 × 515 mm substrates. The machine offers high alignment precision and a large field of view.
What to know
- 01
The planned expansion covers lithography equipment for semiconductor back-end processing, with the increase measured against current capacity.
- 02
The head of Canon’s semiconductor equipment division said maskless direct-write patterning is not currently a direct competitor to i-line lithography in RDL production.
Why it matters
The planned capacity increase concerns semiconductor back-end equipment, while Canon’s related equipment development also targets advanced packaging.
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